Hybrid integrated circuit device

A hybrid integrated circuit device comprising:

• a metal substrate covered with an insulation;
• electrode regions disposed on the metal substrate said electrode regions being isolated from each other and substantially covering the metal substrate, said electrode regions covered by a reflective conductive film, said reflective conductive film being configured to reflect light;
• a plurality of light emitting diodes, each diode coupling one electrode region to another to connect all the electrode regions in series;
• and
• a circuit mounted on the metal substrate for driving said light emitting diodes, said circuit covered by a reflective conductive film.

A hybrid integrated circuit device comprising:

• a substrate;
• electrode regions disposed on the substrate, said electrode regions being isolated from each other;
• a reflective conductive film covering the electrode regions;
• a plurality of light emitting diodes, each diode coupling one electrode region to another to connect all the electrode regions in series;
• and
• a circuit mounted on the substrate for driving said light emitting diodes, said circuit covered by a reflective conductive film;
• an island-like conductive pattern, comprising a reflective conductive film, disposed in regions on the substrate not occupied by the electrode regions and the circuit;
• wherein said electrode regions, the island-like conductive pattern, and the circuit substantially cover the substrate, said island-like conductive pattern is an alignment mark.

A hybrid integrated circuit device comprising:

• a metal substrate covered with an insulation;
• electrode regions disposed on the metal substrate, said electrode regions being isolated from each other;
• a reflective conductive film covering the electrode regions;
• a plurality of light emitting diodes, each diode coupling one electrode region to another to connect all the electrode regions in series;
• and
• a circuit mounted on the metal substrate for driving said light emitting diodes, said circuit covered by a reflective conductive film;
• an island-like conductive pattern, comprising a reflective conductive film, disposed in regions on the metal substrate not occupied by the electrode regions and the circuit;
• wherein said electrode regions, the island-like conductive pattern, and the circuit substantially cover the metal substrate, said island-like conductive pattern is configured to stop a flow of a resin.

A hybrid integrated circuit device comprising:

• a metal substrate covered with an insulation;
• a first wiring region disposed at one end of the metal substrate;
• a second wiring region disposed at the opposite end of the metal substrate;
• a plurality of electrodes disposed between said first wiring region and said second wiring region;
• a plurality of light emitting diodes, each diode connecting one electrode to another to connect all the electrodes in series;
• the first wiring region and the second wiring region connected in series through the electrodes;
• a circuit mounted on said metal substrate for driving said light emitting diodes;
• and
• an island-like conductive pattern disposed in a region on the metal substrate not occupied by the first and second wiring regions, the electrodes, and the circuit;
• wherein the first and second wiring regions, the electrodes, the island-like conductive pattern, and the circuit substantially cover the metal substrate and are covered with a light reflective film, said island-like conductive pattern is an alignment mark.

A light irradiating apparatus comprising:

• a plurality of the hybrid integrated circuit devices comprising
• a metal substrate covered with an insulation;
• a wiring portion disposed substantially over the metal substrate and substantially covered by a reflective conductive film, comprising electrode regions, said electrode regions isolated from each other by a gap;
• a mounting region formed on each electrode region;
• and
• a light emitting element mounted on each mounting region and connecting one electrode region to another in series;
• a metallic container with the hybrid integrated circuit devices forming a bottom;
• wherein water for cooling the devices also feeds a plant placed on the devices and a light generated by the devices promotes plant growth.