Semiconductor apparatus with misalignment mounting detection

#The present invention relates to a semiconductor apparatus comprising a semiconductor device mounted on a wiring substrate. Moreover, this invention relates to a method of and apparatus for mounting a semiconductor-device.

#When mounting a semiconductor device such as a flip chip or a BGA (Ball Grid Array) onto a wiring substrate, it is difficult to position the device against the wiring substrate while visually checking. The reason for this is that the functional electrode sections, such as bumps and conductor pads on the surface of the wiring substrate, which are to be connected to each other, are both hidden. If the semiconductor device is mounted on the wiring substrate in a misaligned position, the desired functioning cannot be expected from the semiconductor device and extensive repairs involving replacement will be required.

#The following methods are known conventionally that try to solve the above problem. This is, a method wherein positioning slots (i.e., slots used when positioning is performed) or positioning projections (i.e., projections used when positioning is performed) are provided on the conductor pads of the wiring substrate, a method wherein the functional electrodes of the semiconductor device has special shapes, and a method wherein the misalignment is detected by placing a through-hole in the semiconductor device. However, these methods require separate manufacturing processes and different equipment for manufacturing the conductor pads plus the functional electrode section and for configuring the through-holes, causing the manufacturing costs to increase remarkably. Moreover, in the latter method, because the manufacturing process for making the through-holes differs from that for configuring the functional electrode sections of the semiconductor devices, misalignment of the through-holes and the functional electrode section is caused, with a possibility of decreasing the mounting accuracy of the semiconductor device.

#FIG. 1 shows a configuration of a semiconductor apparatus according to a first embodiment of the present invention, and in particular, the top part in this figure shows a conceptual diagram of the reverse side of a semiconductor device, and the bottom part shows a conceptual diagram of the top surface of a wiring substrate.

#FIG. 2A to FIG. 2D show the method of mounting the semiconductor device against the wiring substrate in the semiconductor apparatus shown in FIG. 1, and, in particular, FIG. 2A shows a conceptual profile of a state just before mounting, FIG. 2B shows a conceptual profile of a state of mounting in a regular mounting position, FIG. 2C shows a conceptual profile of a state in which misalignment is caused, and FIG. 2D shows an alternative to the arrangement of FIG. 2B.

#FIG. 3A to FIG. 3D show a configuration of a semiconductor apparatus according to a second embodiment of the present invention and, in particular, FIG. 3A shows a conceptual diagram of the surface of a semiconductor device, FIG. 3B shows a conceptual diagram of the reverse side of the semiconductor device, FIG. 3C shows a conceptual diagram of the top surface of a wiring substrate, and FIG. 3D shows a conceptual profile of a state of mounting in a regular mounting position.

#Embodiments of a semiconductor apparatus, a method of and apparatus for mounting a semiconductor-device according to the present invention will be explained in detail while referring to accompanying drawings.

#FIG. 1 shows a configuration of a semiconductor apparatus according to a first embodiment of the present invention. FIG. 2A to FIG. 2C show a mounting method of a semiconductor device against a wiring substrate in the semiconductor apparatus shown in FIG. 1. The semiconductor apparatus exemplified here is configured so that desired functions are provided, comprising a flip chip or BGA semiconductor device 20 mounted in a mounting position on the wiring substrate 10, and a functional electrodes 21 of the semiconductor device 20 electrically connected to respective conductor pads 11 of the wiring substrate 10. As shown in FIG. 1 and FIG. 2A, while the semiconductor device 20 comprises a pair of detection terminals 22 and 23 and device contact terminals 24 and 25, the wiring substrate 10 comprises substrate contact terminals 12 and 13.

#The detection terminals 22 and 23 are spaced apart on the surface of the semiconductor device 20 and laid out protruded in positions parallel to each other. The device terminals 24 and 25 are laid out protruded in positions surrounding the functional electrodes 21 on the reverse side of the semiconductor device 20. In the first embodiment, the device terminals 24 and 25 are provided in two positions that lie on a diagonal line of the semiconductor device 20. Although the detection terminal 22 and the device terminal 24 are individually provided here, the configuration is not necessarily restricted to this example, that is, one of these terminals may be provided so that it perforates through the semiconductor device 20, wherein the perforated end will function as the other one of these terminals.