Mounting structure of electronic component on substrate board
AssigneeDenso Corporation
InventorsKenji Kondo, Masayuki Aoyama, Koji Kondo, Masanori Takemoto
Life of this patent
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Abstract
An electronic component unit includes an interposer with a plurality of holes and a circuit wiring layer disposed on one surface of the interposer. The electronic component is electrically connected to the circuit wiring layer. A plurality of solder bumps are electrically connected to one surface of the circuit wiring layer through the holes formed in the interposer. The circuit wiring layer is electrically connected to an outside circuit through the solder bumps. A junction interface between the circuit wiring layer and each of the solder bumps is made of ductile metal.
Claims9
An electronic component unit, comprising:
- an interposer having a plurality of holes, the interposer being disposed on an electronic component;
- a circuit wiring layer disposed on one surface of said interposer, wherein said electronic component is electrically connected to said circuit wiring layer;
- a plurality of solder bumps electrically connected to one surface of said circuit wiring layer through said holes formed in said interposer;
- wherein:
- said circuit wiring layer is electrically connected to an outside circuit through said solder bumps;
- and
- a junction interface is formed between said circuit wiring layer and each of said solder bumps, wherein the junction interface is made of ductile material.
Dependencies are inferred from the claim text.