Back to results
US 6,548,759 B1Granted
Pre-drilled image sensor package
AssigneeAmkor Technology, Inc.
InventorsThomas P. Glenn, Steven Webster, Roy Dale Hollaway
Life of this patent
Estimating the term…
Abstract
An image sensor package includes a substrate having a central aperture. Electrically conductive traces on a lower surface of the substrate include tabs projecting below and under hanging the central aperture. An image sensor is flip chip mounted to the tabs and thus supported in the central aperture by the tabs. By mounting the image sensor in the central aperture, the resulting image sensor package is relatively thin.
Claims23
An image sensor package comprising:
- a substrate comprising a sidewall defining a central aperture of said substrate;
- electrically conductive traces coupled to a first surface of said substrate, said electrically conductive traces comprising tabs projecting beyond said sidewall;
- an image sensor supported in said central aperture by said tabs, wherein said image sensor comprises an active area on a first surface of said image sensor;
- and
- a window coupled to said first surface of said image sensor, said window covering and protecting said active area.
2 more elements
An image sensor package comprising:
- a substrate selected from the group consisting of a printed circuit board, a ceramic and a tape, said substrate comprising a first surface and a sidewall defining a central aperture of said substrate;
- electrically conductive traces coupled to said first surface of said substrate, said traces comprising tabs projecting beyond said sidewall, said traces further comprising ends;
- an image sensor comprising an active area and bond pads on a first surface of said image sensor, said image sensor supported in said central aperture of said substrate by said tabs;
- bumps physically and electrically coupling said bond pads to said tabs;
- interconnection balls formed in pockets defined by said ends and interconnection ball apertures of said substrate, said interconnection balls extending through said substrate and projecting above a second surface of said substrate;
- and
- a window coupled to said first surface of said image sensor, said window covering and protecting said active area.
4 more elements
Dependencies are inferred from the claim text.