US 6,548,757 B1 · Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies

Abstract

Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates. Each conductive member can have a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated conductive section connecting the bond-site to the external connector. The conductive members are generally arranged so that at least some of the bond-sites are arranged in a first row in which the bond-sites and a portion of the elongated sections are spaced apart from one other by a first gap width. The support structure can more specifically include a first conductive member having a first bond-site coupled to the Vref bond-pad by a first wire-bond line and a second conductive member having a second bond-site coupled to the signal bond-pad by a second wire-bond line. The first bond-site of the first conductive member can be spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width.

Claims24

Dependent claims

A microelectronic device assembly, comprising:

a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the bond-pads including a reference voltage (Vref) bond-pad and a signal bond-pad immediately adjacent to the Vref bond-pad;
and
a support structure having a plurality of conductive members coupled to the die, the conductive members having a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end with an external connector, and an elongated section connecting the bond-site to the external connector, the conductive members being arranged so that at least a portion of the bond-sites are arranged in a first row and spaced apart from one another by a first gap distance, and the conductive members including a first conductive member having a first bond-site coupled to the Vref bond-pad and a second conductive member having a second bond-site coupled to the signal bond-pad, the first bond-site of the first conductive member being spaced apart from the second bond-site of the second conductive member by a second distance greater than the first distance.

A microelectronic device assembly, comprising:

a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the bond-pads including a reference voltage (Vref) bond-pad and a signal bond-pad proximate to the Vref bond-pad;
and
a support structure having a plurality of conductive members coupled to the die, the conductive members including a first conductive member having a first elongated section and a first bond-site coupled to the Vref bond-pad by a first wire-bond line, a second conductive member having a second elongated section and a second bond-site coupled to the signal bond-pad by a second wire-bond line immediately adjacent to the first wire-bond line without an interposing wire-bond line from another bond-pad on the microelectronic die being between the first and second wire-bond lines, and a third conductive member having a third elongated section, wherein a portion of the first elongated section proximate to the first bond-site is immediately adjacent to and spaced apart from an adjacent portion of the third elongated section by a first distance, and wherein the portion of the first elongated section proximate to the first bond-site is spaced apart from a portion of the second elongated section proximate to the second bond-site by a second distance that is greater than the first distance.

A microelectronic device assembly, comprising:

a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the bond-pads including a reference voltage (Vref) bond-pad and a signal bond-pad proximate to the Vref bond-pad;
a support structure having a plurality of conductive members coupled to the die, the conductive members having a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated section connecting the bond-site to the external connector, the conductive members being arranged so that at least a portion of the bond-sites are arranged in a first row and spaced apart from one another by a first gap width, and the conductive members including a first conductive member having a first bond-site and a second conductive member having a second bond-site, the first bond-site of the first conductive member being spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width;
and
a plurality of wire-bond lines including a first wire-bond line from the Vref bond-pad to the first bond-site of the first conductive member and a second wire-bond line from the signal bond-pad to the second bond-site of the second conductive member, the first and second wire-bond lines being immediately adjacent to one another without an interposing wire-bond line from another bond-pad on the microelectronic die being between the first and second wire-bond lines.

1 more element

A microelectronic device assembly, comprising:

a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the bond-pads including a reference voltage (Vref) bond-pad and a signal bond-pad proximate to the Vref bond-pad;
a support structure having a plurality of conductive members coupled to the die, each conductive member having a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end with an external connector, and an elongated section connecting the bond-site to the external connector, the conductive members being arranged so that at least a portion of the bond-sites are in a first row proximate to one side of the bond-pads on the die, and the conductive members including a first conductive member, a second conductive member, and a third conductive member, the third conductive member coupled to an electrical potential and having a shielding section immediately adjacent to and between at least a portion of the first and second conductive members;
and
a plurality of wire-bond lines including a first wire-bond line from the Vref bond-pad to the first bond-site of the first conductive member and a second wire-bond line from the signal bond-pad to the second bond-site of the second conductive member.

1 more element

Dependencies are inferred from the claim text.

Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies

Life of this patent

Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies

Life of this patent

Abstract

Claims24