Epoxy resin composition and process for producing the same
AssigneeJapan Epoxy Resins Co., Ltd.
InventorYasuyuki Murata
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Abstract
The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.
Claims5
A tetramethylbiphenyl type epoxy resin composition comprising an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound, wherein said composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1):
- of 0.5% by weight or less.
A process for producing a tetramethylbiphenyl type epoxy resin composition having a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1):
- of 0.5% by weight or less, comprising reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl having a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a phenol compound represented by the following structural formula (2):
- of 0.5% by weight or less, and an epihalohydrin in the presence of an alkali metal compound.
Dependencies are inferred from the claim text.