Electrical and thermal contact for use in semiconductor devices

A method for thermally insulating a phase change component of a semiconductor device structure, comprising:

• forming a first conductive layer in communication with said phase change component;
• providing a thermal insulator component on said first conductive layer so as to at least partially thermally insulate said phase change component;
• forming a second conductive layer at least partially over said thermal insulator component and in communication with said first conductive layer;
• and
• patterning said first and second conductive layers so as to maintain said communication between said first and second conductive layers.

A method for fabricating a contact for a semiconductor device structure that includes a phase change component, comprising:

• forming a first conductive structure in communication with the phase change component;
• providing a thermal insulator component in contact with said first conductive structure, opposite the phase change component and positioned to at least partially thermally insulate the phase change component;
• and
• forming a second conductive structure in contact with said thermal insulator component, opposite said first conductive structure and in communication with said first conductive structure.