Semiconductor apparatus and method of fabricating semiconductor apparatus

Abstract

To be capable of arbitrarily designing an interconnection shape of a surface layer to thereby promote reliability of connection in laminating layers and making destruction of a semiconductor element difficult to cause in a semiconductor apparatus having interconnections for connecting laminated layers on a surface and a back of a substrate and capable of laminating layers in multiple stages, a semiconductor apparatus is fabricated by a step of mounting a semiconductor element in a recess portion shallower than a thickness of a semiconductor element formed in a surface of a substrate having interconnection patterns connected by a through hole on two of the surface and a back in which a thickness of an interconnection on the surface is made thicker than a thickness of an interconnection on the back with a front thereof disposed on the lower side, a step of sealing the semiconductor element in the recess portion by synthetic resin and a step of grinding the substrate and the semiconductor element up to the interconnection on the surface.

Dependencies are inferred from the claim text.