Low cost electroless plating process for single chips and wafer parts and products obtained thereof
AssigneesInteruniversitair Microelektronica Centrum vzw, Universiteit Gent
InventorsHerbert De Pauw, Jan Vanfleteren, Suixin Zhang
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Abstract
The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
Claims24
A method for electroless plating individual chips with bond pads, the method comprising the steps of:
- providing a carrier and an adhesive;
- attaching the individual chip to a carrier, the step of attaching consisting of contacting the adhesive with at least a portion of the individual chip;
- and
- electroless plating the bond pads of said individual chip.
A method for electroless plating at least two chips, the chips having bond pads, the method comprising the steps of:
- attaching the chips to a carrier;
- electroless plating the bond pads of the chips;
- and
- dicing to separate the chips,
- wherein the steps of electroless plating the bond pads and dicing are performed with the same carrier.
Dependencies are inferred from the claim text.