Semiconductor device and process of producing same

A process for producing a semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, comprising:

• providing a wafer having a plurality of chip-sized packages formed thereon as the first electronic parts, wherein the chip-sized packages have an area substantially the same as the that of a semiconductor chip mounted thereon and have a first pad forming surface comprising an array of connection terminal pads;
• bonding bent wires to a plurality of the connection terminal pads to form springy wire form connection terminals which are bonded to selected connection terminal pads of the first electronic part other than those connection terminal pads used to bond the second electronic part, wherein the ends of the springy wire form connection terminals protrude above the connected second electronic part;
• electrically connecting the first electronics part with the second electronics part, said second electronics part comprising a second pad forming surface, by flip-chip bonding such that the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other;
• and cutting the wafer to separate the chip-sized packages one from another, such that the chip-sized packages have a first electronics part and a second electronics part.

A process for producing a semiconductor device having a semiconductor chip and at least one other electronic part, the process comprising:

• providing a wafer comprising a plurality of semiconductor chip assemblies, each semiconductor chip assembly having a first length and first width, when viewed from above, and having a semiconductor chip with a length and width substantially the same as the first length and first width mounted thereon, wherein the semiconductor chip comprises an array of a first number of chip connection terminal pads disposed on a top surface thereof, said top surface being opposite the surface on which the first chip is mounted to the semiconductor chip assembly;
• providing a second electronic part having a second length and second width, when viewed from above, and having a second number of electronic part connection terminal pads disposed on a bottom surface thereof, wherein at least one of the first length and first width is greater than the second length and second width, respectively, wherein the first number of chip connection terminal pads is greater than the second number of electronic part connection terminal pads, and wherein a plurality of the electronic part connection terminal pads or chip connection terminal pads or both comprise stud bumps conductively attached directly thereto;
• placing the semiconductor chip assembly and the second electronic part such that respective terminal-containing surfaces face one another, and electrically connecting the semiconductor chip assembly and the second electronic part by flip-chip bonding the semiconductor chip assembly and the second electronic part;
• bonding resilient wires to a plurality of selected chip connection terminal pads, other than those chip connection terminal pads used to bond the second electronic part, to form a plurality of springy wire form connection terminals;
• and cutting the wafer to separate the chip-sized packages one from another, such that the chip-sized packages have a first electronics part and a second electronics part.