Method of preparing light-sensitive integrated circuits for packaging

A method for preparing light-sensitive integrated circuits for packaging, the method comprising the steps of:

• providing a semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on an upper surface of the semiconductor substrate;
• dicing the semiconductor substrate into individual light-sensitive integrated circuits, each of the individual light-sensitive integrated circuits having a semiconductor substrate lower surface and semiconductor substrate lateral edges;
• and
• spray coating the semiconductor substrate lateral edges with an opaque ink to form an opaque layer covering the semiconductor substrate lateral edges,
• wherein the spray coating step is conducted as the individual light-sensitive integrated circuits are conveyed through a pass-through and wherein the spray coating step utilizes piezoelectric injectors arrayed around the pass-through for spray coating.

A method for preparing light-sensitive integrated circuits for packaging, the method comprising the steps of:

• providing a semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on an upper surface of the semiconductor substrate;
• dicing the semiconductor substrate into individual light-sensitive integrated circuits, each of the individual light-sensitive integrated circuits having a semiconductor substrate lower surface and semiconductor substrate lateral edges;
• and
• depositing an opaque material on the semiconductor substrate lateral edges to form a deposited opaque layer covering the semiconductor substrate lateral edges.

A method for preparing light-sensitive integrated circuits for packaging, the method comprising the steps of:

• providing a semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on an upper surface of the semiconductor substrate;
• dicing the semiconductor substrate into individual light-sensitive integrated circuits, each of the individual light-sensitive integrated circuits having a semiconductor substrate lower surface and semiconductor substrate lateral edges;
• and
• roughening the semiconductor substrate lateral edges to form roughened lateral edges that reflect incoming light in a manner that minimizes the light reaching the top, light-sensitive surface of the IC.

A method for preparing light-sensitive integrated circuits for packaging, the method comprising the steps of:

• providing a semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on an upper surface of the semiconductor substrate;
• dicing the semiconductor substrate into individual light-sensitive integrated circuits, each of the individual light-sensitive integrated circuits having a semiconductor substrate lower surface and semiconductor substrate lateral edges;
• and
• coating the semiconductor substrate lateral edges with a material to form a material layer of a thickness that provides for destructive interference of incoming light and, thereby, prevents light from entering the semiconductor substrate.