Epoxy adhesive
AssigneeGeneral Electric Company
InventorsSomasundaram Gunasekaran, Thomas Bert Gorczyca, Herbert Stanley Cole
Life of this patent
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Abstract
In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the group including curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof.
Claims18
An adhesive composition comprising;
- a. epoxidized cashew nutshell liquid,
- b. diglycidyl ether of bisphenol A
- c. at least one catalyst,
- d. at least one curing agent selected from the group consisting of hexahydrophthalic anhydrides, methyl hexahydrophthalic anhydrides, and mixtures thereof, and
- e. at least one additional additive chosen from the group consisting of a bonding enhancer, a hardener, a flexibilizer, a tackifier, and mixtures thereof.
An adhesive formulation suitable for curing comprising:
- a. epoxidized cashew nutshell liquid,
- b. diglycidyl ether of bisphenol A,
- c. a curing agent selected from the group consisting of hexahydrophthalic anhydrides, methyl hexahydrophthalic anhydrides, and mixtures thereof,
- d. at least one additional additive selected from the group consisting of a bonding enhancer, a hardener, a flexibilizer, a tackifier, and mixtures thereof.
An adhesive composition comprising the reaction product of:
- a. epoxidized cashew nutshell liquid,
- b. diglycidyl ether of bisphenol A,
- c. a curing agent selected from the group consisting of hexahydrophthalic anhydrides, methyl hexahydrophthalic anhydrides, and
- d. a catalyst.
A method for forming an adhesive composition comprising the step of mixing together:
- a. epoxidized cashew nutshell liquid,
- b. diglycidyl ether of bisphenol A,
- c. at least one additive selected from the group consisting of curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof, and
- d. adding a catalyst.
An electronic chip package comprising:
- a. an adhesive comprised of epoxidized cashew nutshell liquid, diglycidyl ether of bisphenol A, a curing agent, and a catalyst,
- b. an electronic chip, and
- c. a substrate, wherein said epoxy adhesive at least partially secures said chip to said substrate.
Dependencies are inferred from the claim text.