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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTakayuki Nagai, Yoshio Kubo, Kunihiko Egawa, Osamu Taguchi
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A method for manufacturing a Sn-based alloy containing a finely dispersed Sn—Ti compound includes melting Sn by heating to a temperature in a range from 1300 to 1500° C. in vacuum or an inert gas atmosphere, adding 0.1 to 5% by weight of Ti followed by melting by heating, and casting the molten alloy into a copper mold directly or through a pouring cup. The Sn-based alloy obtained by this method contains the Sn—Ti compound having a maximum particle diameter of 30 μm and a mean particle diameter of 5 to 20 μm. A precursor of a Nb3Sn wire is also obtained by an inner diffusion method using this Sn-based alloy. The Nb3Sn wire manufactured by using the Sn-based alloy of the present invention exhibits excellent superconductive characteristics. The method of the present invention enables the ingot to be free from a shrinkage cavity appearing during prior art manufacturing processes.
An Sn-based alloy containing a Sn—Ti compound prepared by adding 0.1 to 5% by weight of Ti, relative to the content of Sn, wherein particles of the Sn—Ti compound have a maximum diameter not exceeding 30 μm and a mean diameter within a range of 5 to 20 μm.
Dependencies are inferred from the claim text.