Aromatic polyimide film and film laminate
AssigneeUbe Industries, Ltd.
InventorsTomohiko Yamamoto, Takuji Takahashi, Kohji Narui, Hiroto Mitsui, Norihisa Komoda
Life of this patent
Estimating the term…
Abstract
An aromatic polyimide film of polyimide composed of a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 μm and is employed for manufacturing a polyimide film/metal film laminate, preferably has a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. (TD) in the temperature range of 50-200° C., and a modulus of tensile elasticity of 700 kgf/mm2 or more (TD), and has a surface having been subjected to discharge treatment.
Claims14
An aromatic polyimide film of polyimide comprising a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 μm, a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. in a traverse direction thereof in the temperature range of 50 to 200° C., a modulus of tensile elasticity of 700 kgf/mm2 or more in a traverse direction thereof, and a surface which has been subjected to discharge treatment.
An aromatic polyimide film laminate which comprises in order a polyimide film comprising a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, having a thickness of 35 to 55 μm, a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. in a traverse direction thereof in the temperature range of 50 to 200° C., a modulus of tensile elasticity of 700 kgf/mm2 or more in a traverse direction thereof, and having a surface which has been subjected to discharge treatment, an adhesive layer comprising a thermosetting adhesive, and a polymer film having a releasing layer on the surface facing the adhesive layer.
An aromatic polyimide film/metal film laminate which comprises in order a polyimide film comprising a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, having a thickness of 35 to 55 μm, a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. in a traverse direction thereof in the temperature range of 50 to 200° C., a modulus of tensile elasticity of 700 kgf/mm2 or more in a traverse direction thereof, and having a surface which has been subjected to discharge treatment, an adhesive layer comprising a thermosetting adhesive, and a metal film having a thickness of 3 to 35 μm.
An aromatic polyimide film/metal film laminate which comprises in order a polyimide film comprising a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, having a thickness of 35 to 55 μm, a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. in a traverse direction thereof in the temperature range of 50 to 200° C., a modulus of tensile elasticity of 700 kgf/mm2 or more in a traverse direction thereof, and having a surface which has been subjected to discharge treatment, and a metal film which has a thickness of 1 to 20 μm.
An aromatic polyimide film of polyimide consistently essentially of a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 μm, a linear thermal expansion coefficent of 17×10−6 to 24×10−6 cm/cm/° C. in a traverse direction thereof in the temperature range of 50 to 200° C., a modulus of tensile elasticity of 700 kgf/mm2 or more in a traverse direction othereof, and a surface which has been subjected to discharge treatment.
Dependencies are inferred from the claim text.