Epoxy/clay nanocomposite for making printed circuit boards
AssigneesIndustrial Technology Research Institute, Nan Ya Plastics Corporation
InventorsTsung-Yen Tsai, Sung-Jeng Jong, An-Chi Yeh, Joshua Chiang, Bor-Ren Fang
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Abstract
An epoxy/clay nanocomposite suitable for use as matrix material for printed circuit boards is disclosed. The nanocomposite of the present invention comprises a layered clay material uniformly dispersed in an epoxy polymer matrix, wherein the clay material has been modified to an organoclay by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine. The epoxy/clay nanocomposites of the present invention have superior dimensional and thermal stability, and a lower hygroscopic property. The invention also includes the prepregs or circuit boards containing the epoxy/clay nanocomposite.
Claims18
An epoxy/clay nanocomposite, comprising:
- a polymer matrix comprising an epoxy resin;
- and
- an exfoliated layered clay material uniformly dispersed in the polymer matrix, wherein the exfoliated layered clay material is present in an amount ranging from about 0.1% to 10% by weight based on the total weight of the nanocomposite and has been modified by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine.
A prepreg for a printed circuited board, which comprises:
- an epoxy/clay nanocomposite, and a glass cloth impregnated therewith, the epoxy/clay nanocomposite comprising (a) a polymer matrix comprising an epoxy resin;
- and (b) an exfoliated layered clay material uniformly dispersed in the polymer matrix, wherein the exfoliated layered clay material is present in an amount ranging from about 0.1% to 10% by weight based on the total weight of the nanocomposite and has been modified by ion exchange with a modifier.
Dependencies are inferred from the claim text.