Composite material used in making printed wiring boards
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsTakashi Kataoka, Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri, Tsutomu Higuchi
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Abstract
A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.
Claims11
A composite material for placing conductive fine particles on an insulating substrate, said conductive fine particles to be disposed between a carrier and said substrate, comprising a removable conductive carrier and conductive particles releasably deposited on said carrier, wherein an organic compound is used as a release layer between said carrier and said conductive fine particles.
Dependencies are inferred from the claim text.