Processing a printed wiring board by single bath electrodeposition
AssigneeThe Regents of the University of California
InventorsMichael P. Meltzer, Christopher P. Steffani, Ray A. Gonfiotti
Life of this patent
Estimating the term…
Abstract
A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Claims27
A method of processing a printed wiring board by electrodeposition, comprising the steps of:
- implementing initial processing steps on said printed wiring board,
- electrodepositing copper on said printed wiring board from a bath containing nickel and copper,
- electrodepositing nickel on said printed wiring board from said bath containing nickel and copper, and
- implementing final processing steps on said printed wiring board.
In a method of processing a printed wiring board by electrodeposition that includes implementing initial processing steps on said printed wiring board and implementing final processing steps on said printed wiring board, the improvement comprising the intermediate steps of:
- electrodepositing Cu on said printed wiring board from a Ni/Cu bath, and
- electrodepositing Ni on said printed wiring board from said Ni/Cu bath.
A method of processing a printed wiring board by electrodeposition, comprising the steps of:
- implementing initial processing steps on said printed wiring board,
- electrodepositing copper on said printed wiring board from a bath containing copper and nickel using a low reduction potential conducted with high agitation conditions in said bath,
- electrodepositing nickel on said printed wiring board from said bath containing copper and nickel using a high reduction potential conducted with low agitation conditions in said bath, and
- implementing final processing steps on said printed wiring board.
Dependencies are inferred from the claim text.