Commercial plating of nanolaminates
AssigneeDelphi Technologies, Inc.
InventorsChris M. Schreiber, Mordechay Schlesinger, Robert Martinez, Haim Feigenbaum, William Robert Crumly
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Abstract
A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.
Claims32
A method for forming a nanolaminate structure, the method comprising:
- providing a bath containing ions of a first metal and ions of a second metal;
- placing a substrate which acts as a cathode at least partially within the bath;
- plating the cathode with one layer of substantially the first metal to a first metal thickness and one layer of substantially the second metal to a second metal thickness, using an electrolytic plating process;
- and
- repeating said plating steps to obtain a predetermined number of layers;
- wherein a plating current is controlled to obtain a desired current density at the cathode within a predefined range, and wherein at least one of the first metal thickness and the second metal thickness are less than 100 nanometers.
A method for forming a nanolaminate structure, the method comprising:
- defining a conductive pattern on a mandrel;
- plating the conductive pattern on the mandrel with a plurality of alternating layers of substantially a first metal and substantially a second metal so as to at least partially define the nanolaminate structure;
- and separating the nanolaminate structure from the mandrel;
- wherein plating the mandrel comprises providing a bath containing ions of the first metal and ions of the second metal, placing the mandrel which acts as a cathode at least partially within the bath, and controlling a plating current such that a current density at the cathode is maintained within a predefined range.
A method for forming a nanolaminate structure, the method comprising:
- providing a bath containing ions of a more noble metal and ions of a less noble metal;
- placing a substrate which acts as a cathode at least partially within the bath;
- plating the cathode with one layer of substantially the more noble metal and substantially none of the less noble metal to a metal thickness and one layer of an alloy of the more noble and less noble metals to an alloy thickness, using an electrolytic plating process;
- and
- repeating said plating steps to obtain a predetermined number of layers;
- wherein a plating current is controlled to obtain a desired current density at the cathode within a predefined range and wherein at least one of the metal thickness and the alloy thickness are less than 100 nanometers.
A method for forming a nanolaminate structure, the nanolaminate structure comprising at least one layer of substantially a first metal having an individual layer thickness of 1000 nanometers or less, adjacent at least one layer of an alloy of the first metal and a second metal having an individual layer thickness of 1000 nanometers or less, the method comprising:
- defining a conductive pattern on a mandrel;
- plating the conductive pattern on the mandrel with a plurality of alternating layers of substantially the first metal and the alloy of the first metal and the second metal so as to at least partially define the nanolaminate structure;
- and
- separating the nanolaminate structure from the mandrel;
- wherein plating the mandrel comprises providing a bath containing ions of the first metal and ions of the second metal, placing the mandrel which acts as a cathode at least partially within the bath, and controlling a plating current such that a current density at a cathode is maintained within a predefined range.
Dependencies are inferred from the claim text.