Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method

A semiconductor manufacturing facility comprising:

• a clean room;
• a semiconductor manufacturing equipment provided in the clean room and configured to generate heat during use;
• a housing configured to cover the semiconductor manufacturing equipment;
• a plurality of exhaust passage members configured to exhaust air in said housing to outside said clean room;
• a separation and enclosure member provided to isolate said housing from an atmosphere of said clean room by enclosing said housing, the separation and enclosure member configured to be capable of introducing air in said clean room into an interior thereof;
• and
• a heat insulating material associated with said separation and enclosure member and configured to reduce the release of heat from the interior of said separation and enclosure member to the air inside said clean room.

A semiconductor manufacturing facility comprising:

• a clean room;
• a semiconductor manufacturing equipment provided in the clean room and configured to generate heat during use;
• a housing configured to cover the semiconductor manufacturing equipment;
• a plurality of exhaust passage members configured to exhaust air in said housing to outside said clean room;
• an air introducing passage member configured to introduce air outside said clean room into said housing;
• and
• a heat insulating material associated with said housing and configured to reduce the release of heat from the interior of said housing to the air inside said clean room.

A semiconductor manufacturing facility comprising:

• a clean room;
• a semiconductor manufacturing equipment provided in the clean room and configured to generate heat during use;
• a housing configured to cover the semiconductor manufacturing equipment;
• a plurality of exhaust passage members configured to exhaust air in said housing to outside said clean room;
• a separation and enclosure member provided to isolate said housing from an atmosphere of said clean room by enclosing said housing;
• an air introducing passage member provided to introduce air outside said clean room into a space between said separation and enclosure member and said housing, the air introducing passage member being provided with a heat insulating material;
• and
• another heat insulating material associated with said separation and enclosure member and configured to reduce the release of heat from the interior of said separation and enclosure member to the air inside said clean room.

A semiconductor manufacturing apparatus arranged in a clean room and configured to generate heat when a predetermined process is applied to an object to be processed, said semiconductor manufacturing apparatus comprising:

• a processing part configured to apply the predetermined process to said object to be processed;
• a housing configured to cover the processing part and configured to be capable of introducing air inside said clean room into an interior thereof;
• a first exhaust passage member configured to exhaust air in said housing to outside said clean room;
• a heat insulating material provided on an outer surface of said housing to reduce the release of heat from said housing to said clean room.

A semiconductor manufacturing apparatus arranged in a clean room and configured to generate heat when a predetermined process is applied to an object to be processed, the semiconductor manufacturing apparatus comprising:

• a processing part configured to apply the predetermined process to said object to be processed;
• a carry-out chamber configured to accommodate said object to be processed and to carry the processed object out of said processing part;
• a housing configured to cover said processing part and said carry-out chamber;
• a first exhaust passage member configured to exhaust air into a surrounding area of said processing part to outside said clean room;
• a second exhaust passage member configured to exhaust air into a surrounding area of said carry-out chamber to outside said clean room;
• an air introducing passage member capable of introducing air inside the clean room into the surrounding area of said processing part;
• air introducing means for introducing the air inside the clean room into the surrounding area of said carry-out chamber;
• and
• a plurality of heat insulating materials associated with said housing and said air introducing passage member, wherein at least one heat insulating material of the plurality of heat insulating materials is provided on an outer surface of the housing.

A method for manufacturing a semiconductor device by using a semiconductor manufacturing apparatus comprising:

• a processing part configured to apply predetermined process to said object to be processed;
• a carry-out chamber configured to accommodate said object to be processed and to carry the processed object out of said processing part;
• a housing configured to cover said processing part and said carry-out chamber;
• a first exhaust passage member configured to exhaust air in a surrounding area of said processing part to outside said clean room;
• a second exhaust passage member configured to exhaust air in a surrounding area of said carry-out chamber to outside said clean room;
• an air introducing passage member capable of introducing air inside the clean room into the surrounding area of said processing part;
• air introducing means for introducing the air inside the clean room into the surrounding area of said carry-out chamber;
• and
• a plurality of heat insulating materials associated with said housing and said air introducing passage member, at least one heat insulating material of the plurality of heat insulating materials being provided on an outer surface of the housing, the method comprising:
• introducing air outside said clean room into the surrounding area of said processing part through said air introducing passage member;
• exhausting the air through the first exhaust passage to outside said clean room;
• introducing air inside said clean room through the air introducing means into the surrounding area of said carry-out chamber;
• and
• exhausting the air through the second exhaust passage to outside said clean room.