Polishing apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorTakao Inaba
Life of this patent
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Abstract
In a wafer polishing apparatus 1 according to this invention, waiting units 43 having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit 3 to a polishing head 42 or vice versa are provided to a polishing unit 4, and the upper/lower stage wafer placement tables can move individually. A spindle-washing unit 44 for washing polishing heads is disposed inside a lower space below the waiting units.
Claims13
A wafer polishing apparatus including an index unit for delivering a wafer from a cassette to a loal/unload unit, said load/unload unit for relaying said wafer from said index unit to a polishing unit and from said polishing unit to a washing unit, said polishing unit for polishing said wafer and said washing unit for washing said wafer after polishing, wherein:
- waiting units each including a wafer placement table having an upper/lower two-stage structure, for temporarily placing said wafer transferred from said load/unload unit to said polishing head or from said polishing head to said load/unload unit, are provided to said polishing unit, and both of said upper-stage and lower-stage wafer placement tables can slide individually.
A wafer polishing apparatus according to claim 3, wherein said upper-stage wafer placement of said waiting unit communicates with a feed water pipe upon reaching a position at which said wafer placement table delivers said wafer placed thereon to said polishing head, forms a film of water on said upper-stage wafer placement table of said waiting unit, and supports said wafer.
A wafer polishing apparatus including an index unit for delivering a wafer from a cassette to a load/unload unit, said load/unload unit for delivering said wafer from said index unit to a polishing unit and from said polishing unit to a washing unit, said polishing unit for polishing said wafer, and said washing unit for washing said wafer after polishing, wherein:
- said polishing unit includes a spindle-washing unit comprising an annular brush and a water injection nozzle for washing a wafer holding surface of said polishing head.
Dependencies are inferred from the claim text.