Method for supplying slurry to a semiconductor processing machine

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry, wherein the supply includes a reservoir holding slurry, a supply conduit connected to the reservoir, and a supply conduit pump associated with the supply conduit;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump, wherein conveying slurry from the supply to the basin comprises pumping the slurry with the supply conduit pump through the supply conduit from the reservoir remote from the semiconductor processing machine to the basin proximate the semiconductor processing machine, and wherein the slurry proximate the semiconductor processing machine is unpressurized;
• and
• conveying slurry via the delivery subsystem from the basin to the semiconductor processing machine via a second pump.

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump;
• and
• conveying slurry from the basin to the semiconductor processing machine via a second pump,
• wherein the delivery subsystem further includes an inflow conduit which directs slurry from the supply to the basin and includes an outflow conduit which directs slurry from the basin to the semiconductor processing machine, wherein the first pump is an inflow conduit pump which pumps slurry from the supply to the basin through the inflow conduit, and the second pump is an outflow conduit pump which pumps slurry from the basin to the semiconductor processing machine through the outflow conduit, and
• wherein the inflow conduit includes an opening from which slurry may flow into the basin, the opening of the inflow conduit being situated in the basin such that during operation of the delivery subsystem the opening is submerged in the slurry in the basin to inhibit foaming of the slurry in the basin.

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump;
• and
• conveying slurry from the basin to the semiconductor processing machine via a second pump,
• wherein the delivery subsystem further includes an inflow conduit which directs slurry from the supply to the basin and includes an outflow conduit which directs slurry from the basin to the semiconductor processing machine, wherein the first pump is an inflow conduit pump which pumps slurry from the supply to the basin through the inflow conduit, and the second pump is an outflow conduit pump which pumps slurry from the basin to the semiconductor processing machine through the outflow conduit, and
• wherein the outflow conduit includes an opening into which slurry from the basin may enter, the opening of the outflow conduit being situated in the basin such that during operation of the delivery subsystem the opening is submerged in the slurry in the basin to inhibit air from entering the outflow conduit.

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump, wherein the basin includes a drain which allows slurry to flow from the basin, and wherein the slurry in the basin is agitated by the flow of slurry into the basin from the supply and out of the basin through the drain, thereby inhibiting the suspended particles from settling;
• and
• conveying slurry from the basin to the semiconductor processing machine via a second pump.

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump, wherein the basin includes a top portion and a lip adjacent the top portion, the lip allowing overflow of the slurry from the basin, thereby inhibiting the settling of suspended particles in the slurry;
• and
• conveying slurry from the basin to the semiconductor processing machine via a second pump.

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump, wherein the basin includes a top portion and an overflow gate oriented in the top portion, the overflow gate channeling slurry out of the basin, thereby inhibiting the settling of suspended particles in the slurry;
• and
• conveying slurry from the basin to the semiconductor processing machine via a second pump.

The method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a delivery subsystem including a basin via a first pump, wherein the basin includes a container which receives slurry, a drain in the container, the drain allowing slurry to flow from the container, wherein the slurry in the container is agitated by the flow of slurry into the container and out of the container through the drain, and an enclosure surrounding the container, wherein the enclosure collects slurry flowed through the drain of the container;
• and
• conveying slurry from the basin to the semiconductor processing machine via a second pump.

A method for supplying a slurry of liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a basin;
• draining a portion of the slurry from the basin through a drain and mixing the portion of the slurry drained from the basin with other slurry prior to returning the slurry to the basin;
• and
• conveying a portion of the slurry from the basin to the semiconductor processing machine;
• wherein the slurry in the basin is agitated by conveying and draining slurry, thereby inhibiting the settling of suspended particles in the slurry.

The method for supplying a slurry of liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, the method comprising:

• providing a supply of slurry;
• conveying slurry from the supply to a basin;
• draining a portion of the slurry from the basin through a drain;
• overflowing the slurry in the basin;
• and
• conveying a portion of the slurry from the basin to the semiconductor processing machine, wherein the slurry in the basin is agitated by conveying, draining, and overflowing, thereby inhibiting the settling of suspended particles in the slurry.