Polishing pad
AssigneeTeijin-Metton Kabushiki Kaisha
InventorsTakeyoshi Yamada, Hidetsugu Yoshida, Nobuo Yoshikiyo
Life of this patent
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Abstract
A polishing pad for polishing a surface of a work, (A) said polishing pad being made of a resin formed of a ring-opened polymer from a cycloolefin by metathesis polymerization, and (B) said resin having a heat deformation temperature of 90 to 135° C., a compression elastic modulus of 980 to 2,940 MPa and a water absorption of 0.01 to 0.25% by weight. The polishing pad of the present invention has a proper hardness, shows a low water absorption, causes no damage on a work surface and has durability.
Claims24
A polishing pad for polishing a surface of a work, which comprises
- (A) said polishing pad being made of a resin formed of a ring-opened polymer from a cycloolefin by metathesis polymerization, and
- (B) said resin having a heat distortion temperature of 90 to 135° C., a compression modulus of 980 to 2,940 MPa and a water absorption of 0.01 to 0.25% by weight.
A method for polishing the surface of a work, comprising the steps of:
- providing a polishing pad,
- applying an abrasive slurry containing fine particles to said surface of work, and
- polishing said surface of work with a polishing pad,
- said polishing pad being made of a resin formed of a ring-opened polymer from a cycloolefin by metathesis polymerization, and
- said resin having a heat distortion temperature of 90 to 135° C., a compression modulus of 980 to 2,940 MPa and a water absorption of 0.01 to 0.25% by weight.
Dependencies are inferred from the claim text.