Carrier head with a substrate sensor
AssigneeApplied Materials, Inc.
InventorsSteven M. Zuniga, Ming-Kuei Tseng
Life of this patent
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Abstract
A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.
Claims21
A carrier head, comprising:
- a base;
- a flexible member connected to the base and defining a first chamber and a substrate receiving surface;
- and
- a support pad positioned between the base and the flexible member, the support pad having a sensor aperture and a guardian member extending downward from the support pad and forming a wall around the sensor aperture to block a fluid that can be trapped between the substrate and the flexible member during a substrate attachment procedure from entering the sensor aperture.
The carrier head of claim 2, wherein the support pad further includes a plurality of apertures about the sensor aperture to trap the fluid and prevent the fluid from entering the sensor aperture.
A carrier head, comprising:
- a base;
- a flexible member joined to the base to define a chamber and a substrate receiving surface;
- and
- a support plate positioned between the base and the flexible member, the support plate including a sensor aperture and a plurality of apertures extending about the sensor aperture to provide a plurality of pockets to trap a fluid which may be present between a substrate and the flexible member as a result of a substrate attachment procedure.
Dependencies are inferred from the claim text.