Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
AssigneeMicron Technology, Inc.
InventorScott E. Moore
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorScott E. Moore
Estimating the term…
A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.
A method for transmitting data from a planarizing device having a first portion and a second portion movable relative to the first portion to planarize a substrate positioned therebetween, the method comprising:
A method for transmitting data from a planarizing apparatus having a first portion and a second portion movable relative to the first portion to planarize a semiconductor substrate positioned between the first and second portions, the method comprising:
A method for detecting removal of material from a substrate, the substrate having a first surface and a second surface opposite the first surface, the substrate being light transmissive from the first surface to a point proximate to the second surface, the second surface having a reflective layer attached thereto, the method comprising:
Dependencies are inferred from the claim text.