Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

A method for polishing and then washing a semiconductor wafer, said method comprising:

• removing said semiconductor wafer from a container, configured to hold a plurality of wafers
• chemical mechanical polishing said semiconductor wafer to form a polished semiconductor wafer;
• washing said polished semiconductor wafer to form a clean polished semiconductor wafer;
• spin-drying the clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
• and
• returning said clean and dry polished semiconductor wafer to said container.

An apparatus for polishing and then washing a semiconductor wafer, said apparatus comprising:

• an enclosing structure capable of containing and preventing an atmosphere within said enclosing structure from escaping therefrom to exterior thereof;
• a loading unit for receipt of a semiconductor wafer to be polished;
• a polishing system within said enclosing structure for polishing the semiconductor wafer to form a polished semiconductor wafer, said polishing system including a turntable, a top ring for holding the semiconductor wafer and pressing the semiconductor wafer against said turntable to polish the semiconductor wafer, and means for transferring the semiconductor wafer to a loading position for loading the semiconductor wafer to be polished to said top ring;
• a washing system within said enclosing structure for washing the polished semiconductor wafer to form a clean polished semiconductor wafer;
• a drying system within said enclosing structure for drying the clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
• and
• an unloading unit for receiving the clean and dry polished semiconductor wafer.

A-method for polishing and then washing a semiconductor wafer, said method comprising:

• introducing the semiconductor wafer from the interior of a clean room into an enclosing structure installed in said clean room;
• transferring said semiconductor wafer to a loading position;
• loading said semiconductor wafer from said loading position to a top ring;
• polishing said semiconductor wafer by pressing said semiconductor wafer against a turntable with said top ring to form a polished semiconductor wafer;
• washing said polished semiconductor wafer to form a clean polished semiconductor wafer;
• drying said clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
• removing said clean and dry polished semiconductor wafer from said enclosing structure to said interior of said clean room;
• and
• transferring the semiconductor wafer by at least one robot after said introducing and before said removing.

An apparatus for polishing and then washing a semiconductor wafer, said apparatus comprising:

• an enclosing structure capable of containing and preventing an atmosphere within said enclosing structure from escaping therefrom to exterior thereof;
• at least three turntables within said enclosing structure;
• a plurality of top rings for holding semiconductor wafers and pressing the semiconductor wafers against said turntables to thereby polish the semiconductor wafers;
• and
• a washing system within said enclosing structure for washing the polished semiconductor wafer to form a clean polished semiconductor wafer;
• a drying system within said enclosing structure for drying the clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
• and
• at least one robot for transferring the semiconductor wafer within said enclosing structure.

An apparatus for polishing and then washing a semiconductor wafer, said apparatus comprising:

• an enclosing structure capable of containing and preventing an atmosphere within said enclosing structure from escaping therefrom to exterior thereof;
• a polishing system within said enclosing structure for polishing the semiconductor wafer to form a polished semiconductor wafer, said polishing system including an abrasive cloth that is used for polishing;
• a washing system within said enclosing structure for washing the polished semiconductor wafer to form a clean polished semiconductor wafer;
• a drying system within said enclosing structure for drying the clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
• and
• dressing mechanism for dressing said abrasive cloth, said dressing mechanism comprising a dressing tool that is removably provided in said dressing mechanism so that said dressing tool is attached when dressing is performed.