Socket apparatus particularly adapted for land grid array type semiconductor devices

A socket for removably receiving an electronic part having a plurality of contacts disposed along a bottom surface thereof comprising:

• a contact member mounting plate,
• a plurality of contact members mounted in the contact member mounting plate for providing electrical interconnection between contacts of the electronic part and a circuit board,
• a base member having an electronic part seating aperture mounted on the contact member mounting plate,
• a cover having first and second opposite ends, the first end pivotably mounted on the base member for movement of the cover between opened and closed positions and having at least one spring member urging the cover toward the opened position, the cover having a centrally located heat sink member receiving aperture therethrough,
• a heat sink member mounted for movement relative to the cover, the heat sink member having a portion extending through the heat sink member receiving aperture in the cover in a first direction for engagement with the electronic part disposed in the electronic part seating aperture,
• said portion of the heat sink member extending through the heat sink member aperture being formed with a generally flat engagement surface for engagement with a die portion of the electronic part having a selected outer peripheral configuration, the engagement surface formed with a recessed area containing the peripheral configuration of the die portion so that physical contact of the engagement surface with the die portion will be inboard of the outer periphery thereof, and
• a locking mechanism for locking the cover in the closed position.