Alignment systems for subassemblies of overmolded optoelectronic modules

An overmold assembly comprising:

• an overmold frame adhered to an upper surface of a substrate,
• wherein said overmold frame includes a platform for supporting a retainer assembly and said platform is molded with a slot hole having opposing sides and with a trilobe hole having three sidewalls defining a triangular shape,
• wherein said slot hole is arranged to receive a first post on said retainer assembly and said triangular hole is arranged to receive a second post on said retainer assembly,
• wherein said first post has a cross-sectional size and shape to simultaneously engage each of the opposing sides of said slot hole,
• wherein said second post has a size and shape to simultaneously engage each of the three sidewalls of said trilobe hole, and
• wherein said second post and said trilobe hole cooperate with each other to provide a communication path which allows a material within said trilobe hole to escape to an area outside of said trilobe hole.

An overmold assembly, comprising

• an overmold frame adhered to an upper surface of a substrate,
• wherein said overmold frame includes a platform for supporting a retainer assembly and said platform is molded with a slot hole having opposing sides and with a trilobe hole having three sidewalls defining a triangular shape,
• wherein said slot hole is arranged to receive a first post on said retainer assembly and said triangular hole is arranged to receive a second post on said retainer assembly,
• wherein said first post has a cross-sectional size and shape to simultaneously engage each of the opposing sides of said slot hole, and
• wherein said second post has a size and shape to simultaneously engage each of the three sidewalls of said trilobe hole,
• wherein said substrate is a laminate board containing electrical conductors connected to electrical contacts at the surface of said board, wherein said overmold frame has at least one wall forming a cavity in which said electrical contacts are exposed, wherein said retainer assembly includes a flexible circuit suspended in said cavity by a carrier, and wherein at least one feature of said cavity cooperates with at least one feature of said flexible circuit to align at least one lead of said flexible circuit with a corresponding one of said electrical contacts, and
• wherein said features comprise at least one beveled surface on said flexible circuit and at least one slanted portion of said cavity of said wall for engaging said beveled surface to guide and align said flexible circuit.