Die bonder

A die bonder to which semiconductor pellets, including defective pellets, are supplied in an arranged state, comprising:

• a substrate feeding mechanism for feeding a substrate including a plurality of islands to successively set the islands at a bonding position;
• a defective substrate detecting device for detecting defective islands;
• an image processing device adapted to scan and detect a defective pellet;
• and
• a pellet transfer mechanism configured to pick up and transfer a good pellet, scanned for defects, to the bonding position to mount the pellet in the order of pellets, leaving said defective pellet unpicked when a pellet island set at the bonding position is good, and pick up, transfer, and mount said scanned defective pellet when a pellet island is defective.

A die bonder to which semiconductor pellets, including defective pellets, are supplied in an arranged state, comprising:

• a substrate feeding mechanism for feeding a substrate including a plurality of pellet islands to successively locate the pellet islands at a bonding position;
• a defective substrate detecting device for detecting a defective pellet island;
• an image processing device adapted to scan and detect a defective pellet;
• a stocker for stocking a plurality of defective pellets;
• and
• a pellet transfer mechanism configured such that when a pellet island set at the bonding position is good, said pellet transfer mechanism picks up and carries a good pellet, scanned for defects, to the bonding position for mounting in the order of the pellets arrangement, and when said defective pellet is detected, picks up and carries the defective pellet to an unoccupied space if said stocker has such a space, and leaves the defective pellet unpicked if said stocker has no space, and when a pellet island is defective, picks up and carries said scanned defective pellet to the bonding position for mounting.

A die bonder wherein semiconductor pellets, including defective pellets, are supplied in such a manner that a wafer is divided so that individually divided pellets are maintained substantially in the same arrangement as the original arrangement and map data for defective and good pellets are provided in a wafer stage, said die bonder, comprising:

• a substrate feeding mechanism for feeding a substrate including a plurality of pellet island to successively set the pellet island at a bonding position;
• a defective substrate detecting device for detecting defective pellet islands;
• an image processing device adapted to scan and detect a defective pellet;
• a stocker for stocking a plurality of defective pellets;
• and
• a pellet transfer mechanism configured such that when a pellet island set at the bonding position is good, said pellet transfer mechanism picks up and carries a good pellet, scanned for defects, to a pellet island for mounting in the order of the pellets arrangement based on the map data, and when said defective pellet is detected, picks up and carries the defective pellet into an unoccupied space if said stocker has such a space, and leaves the defective pellet unpicked if said stocker has no space, and said pellet transfer mechanism picks up and carries said scanned defective pellet from said stocker to the pellet island for mounting when a pellet island is defective.

A die bonder to which semiconductor pellets are supplied in a state, comprising:

• a substrate feeding mechanism for feeding a substrate including a plurality of islands to successively set the pellet island at a bonding position,
• a defective substrate detecting device for detecting defective islands,
• a defective pellet detecting device for detecting defective pellets in order to prevent said defective pellet from being used on a non-defective island of a substrate, and
• a pellet transfer mechanism configured to successively pick up and transfer a good pellet, previously scanned for defects, to the bonding position to mount the good pellet when an island set at the bonding position is good, and mount a previously scanned defective pellet when an island is defective.