Printed-wiring substrate and method for fabricating the same

A method for fabricating a printed-wiring substrate comprising an external dielectric resin layer which defines a substrate surface, and a connection pad exposed in an opening which extends through the external dielectric resin layer, which comprises:

• roughening a surface of the external dielectric resin layer among layers of the printed-wiring substrate, in which the connection pad is exposed in an opening of the external dielectric resin layer;
• after the external-dielectric-resin-layer roughening step, forming an Ni plating layer on the connection pad exposed in the opening and then forming an Au plating layer on the Ni plating layer;
• and
• forming a marking ink layer on a portion of the substrate surface after the external-dielectric-resin-layer roughening step and before or after the Ni—Au-plating-layer forming step.

A method for fabricating a printed-wiring substrate comprising an external dielectric resin layer which defines a substrate surface, and a connection pad exposed in an opening which extends through the external dielectric resin layer, which comprises:

• roughening a surface of the external dielectric resin layer among layers of the printed-wiring substrate, in which the connection pad is exposed in an opening of the external dielectric resin layer;
• after the external-dielectric-resin-layer roughening step, forming a plating layer on the connection pad exposed in the opening;
• and
• forming a marking ink layer on a portion of the substrate surface after the external-dielectric-resin-layer roughening step and before or after forming the plating layer.