Oscillator for generating microwave radiation, and method of assembling an oscillator
AssigneeMitel Semiconductor Limited
InventorsJohn Bird, Gary Stephen Flatters, Bernard Whitworth
Life of this patent
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Abstract
An oscillator comprising an oscillator body having a waveguide and a substantially cylindrical bore intersecting the waveguide, and a package comprising a heat sink having a substantially cylindrical portion and an oscillatory semiconductor device supported at one end of the heat sink. The diameter of the cylindrical portion of the heat sink in relation to the diameter of the bore is such that the heat sink is supported in the bore by one of an interference fit and a tight sliding fit, with the semiconductor device being located in the waveguide. The tight sliding fit or interference fit includes a layer of soft deformable material.
Claims36
An oscillator for generating microwave frequency radiation comprising:
- an oscillator body having formed therein a waveguide and a substantially cylindrical bore intersecting the waveguide;
- and
- a package comprising a heat sink having a substantially cylindrical portion and an oscillatory semiconductor device supported at one end of the heat sink;
- in which the diameter of the cylindrical portion of the heat sink in relation to the diameter of the cylindrical bore is such that the heat sink is supported in the bore by one of a) an interference fit, and b) a tight sliding fit, with the semiconductor device being located in the waveguide, the tight sliding or interference fit including a layer of soft deformable material.
A method of assembling an oscillator for generating microwave frequency radiation, the oscillator including an oscillator body having formed therein a waveguide and a substantially cylindrical bore intersecting the waveguide, a package including a heat sink having a substantially cylindrical portion including a layer of soft deformable material, and an oscillatory semiconductor device supported at one end of the heat sink, in which the diameter of the cylindrical portion of the heat sink is larger than the diameter of the cylindrical bore, the method comprising:
- inserting the package into the cylindrical bore such that the package is retained by one of a) an interference fit including a layer of soft deformable material, and b) a tight sliding fit including a layer of soft deformable material, with the semiconductor device being located in the waveguide.
An oscillator for generating microwave frequency radiation, the oscillator comprising:
- an oscillator body having formed therein a waveguide;
- an oscillatory semiconductor device supported in the waveguide;
- and
- a short circuit having a skin of soft metal on at least one outer surface thereof;
- the short circuit having dimensions selected such that the skin allows the short circuit to be supported in the waveguide by one of a) a tight sliding fit, and b) an interference fit.
A method of assembling an oscillator for generating microwave frequency radiation, the oscillator comprising:
- an oscillator body having formed therein a waveguide, an oscillatory semiconductor device supported in the waveguide;
- and a short circuit having a skin of soft metal on at least one outer surface thereof;
- in which the cross-sectional dimensions of the short circuit with the skin are larger than the cross-sectional dimensions of the waveguide, the method comprising inserting the short circuit into the waveguide such that the short circuit is retained in the waveguide by one of a) an interference fit, and b) a tight sliding fit.
An oscillator for generating microwave frequency radiation, the oscillator comprising:
- an oscillator body;
- a waveguide formed in the oscillator body;
- an oscillator package supporting an oscillatory semiconductor device in the waveguide, the oscillator package providing mechanical protection for the oscillatory semiconductor device;
- a conduit formed in the oscillator body, the conduit intersecting the waveguide;
- a choke assembly supported in the conduit;
- a radial disk which is mechanically connected to the choke assembly and which is urged by the choke assembly to be in contact with the oscillator package in the waveguide;
- and
- a frequency tuning probe which is arranged to be moveable into the coaxial resonator volume between the radial disk and the choke assembly to alter the frequency of the radiation generated by the oscillator, the longitudinal axis of the frequency tuning probe being substantially perpendicular to the longitudinal axis of the choke and substantially perpendicular to the longitudinal axis of the waveguide.
A method of tuning an oscillator for generating microwave frequency radiation, wherein the oscillator includes an oscillator body, a waveguide formed in the oscillator body, an oscillator package supporting an oscillatory semiconductor device in the waveguide, and providing mechanical protection for the oscillatory semiconductor device, a conduit formed in the oscillator body, the conduit intersecting the waveguide, a choke assembly supported in the conduit, and a radial disk which is mechanically connected to the choke assembly and which is urged by the choke assembly to be in contact with the package in the waveguide, the method comprising:
- moving a frequency tuning probe into the volume between the radial disk and the choke assembly in a direction which is substantially perpendicular to the longitudinal axis of the choke and which is substantially perpendicular to the longitudinal axis of the waveguide.
An oscillator for generating microwave frequency radiation comprising:
- an oscillator body having formed therein a waveguide and a substantially cylindrical bore intersecting the waveguide;
- and
- a package comprising a heat sink having a substantially cylindrical portion and an oscillatory semiconductor device supported at one end of the heat sink;
- in which the diameter of the cylindrical portion of the heat sink in relation to the diameter of the cylindrical bore is such that the heat sink is supported in the cylindrical bore by one of a) an interference fit, and b) a tight sliding fit, with the semiconductor device being located in the waveguide, and wherein the heat sink is provided with a peripheral layer of soft deformable material which provides the tight sliding fit or interference fit within the cylindrical bore of oscillator body, thereby providing good electrical contact between the heat sink and the oscillator body over substantially all the cylindrical outer surface of the heat sink.
Dependencies are inferred from the claim text.