Semiconductor device with a plurality of stacked boards and method of making
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The substrate has an outline larger than the semiconductor chip. First terminals are formed in a region outside the region of the substrate in which the semiconductor chip is mounted. Second terminals are a part of the interconnecting pattern which exposes its surface opposite to its surface opposing the semiconductor chip in a region closer to a center of the substrate than the first terminals. The semiconductor chip is electrically connected to the first and second terminals.
Claims20
A semiconductor device comprising:
- a semiconductor chip;
- a substrate having an interconnecting pattern formed thereover, the substrate having the semiconductor chip mounted on a surface thereof, the substrate having an outline larger than the semiconductor chip;
- first terminals formed in a region outside a region of the substrate in which the semiconductor chip is mounted;
- and
- second terminals being a part of the interconnecting pattern which exposes its surface opposite to a surface opposing the semiconductor chip in a region closer to a center of the substrate than the first terminals,
- wherein the semiconductor chip is electrically connected to the first and second terminals.
A semiconductor device comprising a plurality of stacked semiconductor devices,
- wherein each of the stacked semiconductor devices comprises:
- a semiconductor chip;
- a substrate having an interconnecting pattern formed thereover, the substrate having the semiconductor chip mounted on a surface thereof, the substrate having an outline larger than the semiconductor chip;
- first terminals formed in a region outside a region of the substrate in which the semiconductor chip is mounted;
- and
- second terminals being a part of the interconnecting pattern which exposes its surface opposite to a surface opposing the semiconductor chip in a region closer to a center of the substrate than the first terminals,
- wherein the semiconductor chip is electrically connected to the first and second terminals,
- wherein the semiconductor chips in upper and lower ones of the stacked semiconductor devices are electrically connected.
Dependencies are inferred from the claim text.