Methods for detaching a layer from a substrate
AssigneeFujitsu Limited
InventorsMark Thomas McCormack, James Roman, Lei Zhang, Solomon I. Beilin
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Abstract
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.
Claims8
A method for detaching a layer from a substrate comprising:
- depositing a first layer on a substrate;
- treating a surface of the first layer to form a treated-surface on the first layer;
- forming a second layer on the treated surface;
- and
- removing the second layer from the treated surface of the first layer,
- wherein said treating of said surface of said first layer comprises exposing said surface to a plasma.
A method for detaching a layer from a substrate comprising:
- depositing a first layer on a substrate;
- treating a surface of the first layer to form a treated-surface on the first layer;
- forming a second layer on the treated surface;
- and
- removing the second layer from the treated surface of the first layer,
- wherein said first layer comprises a dielectric layer, and wherein said treating of said surface of said first layer comprises exposing said surface to a plasma.
Dependencies are inferred from the claim text.