Inkjet printhead assembly having planarized mounting layer for printhead dies
AssigneeHewlett-Packard Company
InventorsMohammad Akhavain, Robert-Scott Melendrino Lopez, Brian J. Keefe, Janis Horvath, Joseph E. Scheffelin, David K. Mc Elfresh
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Abstract
A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.
Claims52
A method of forming an inkjet printhead assembly, the method comprising:
- providing a substrate having a first face;
- disposing a first planarization layer on the first face of the substrate, the first planarization layer having a first surface contacting the first face of the substrate and a second surface opposed to the first surface thereof;
- mechanically planarizing the second surface of the first planarization layer, including reducing a thickness of at least a portion of the first planarization layer;
- and
- mounting a plurality of printhead dies on the second surface of the first planarization layer.
An inkjet printhead assembly, comprising:
- a substrate having a first face;
- a first planarized layer disposed on the first face of the substrate, the first planarized layer having a first surface contacting the first face of the substrate and a mechanically planarized surface having a portion of reduced thickness opposed to the first surface thereof;
- and
- a plurality of printhead dies each mounted on the mechanically planarized surface of the first planarized layer,
- wherein the first planarized layer has a plurality of openings defined therein, each of the openings communicating with the first surface and the mechanically planarized surface of the first planarized layer.
A carrier adapted to receive a plurality of printhead dies each having a plurality of electrical contacts, the carrier comprising:
- a planarized layer including a planarized surface having a portion of reduced thickness adapted to provide mechanical support for the printhead dies;
- and
- a metallized layer defining a plurality of electrical contacts accessible from the planarized surface of the planarized layer and configured for electrical coupling to corresponding ones of the electrical contacts of the printhead dies.
An inkjet printhead assembly, comprising:
- a substrate having a first face;
- a first planarized layer disposed on the first face of the substrate, the first planarized layer having a first surface contacting the first face of the substrate and a mechanically planarized surface opposed to the first surface thereof, and
- a plurality of printhead dies each mounted on the mechanically planarized surface of the first planarized layer,
- wherein the mechanically planarized surface reduces a thickness of at least a portion of the first planarized layer.
Dependencies are inferred from the claim text.