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US 6,543,513 B1Granted
Wafer table for die bonding apparatus
AssigneeASM Assembly Automation Ltd.
InventorsSiu Wing Lau, Yuk Cheung Au
Life of this patent
Estimating the term…
Abstract
Die bonding apparatus is provided in which in order to move a target die to a pick-up position, a wafer table is moved by rotation and along one linear axis. This reduces the footprint of the apparatus in comparison to prior art apparatus in which this movement is accomplished by movement along two orthogonal linear axes. In an embodiment of the invention, however, movement along a second orthogonal liner axis may also be provided whereby a user may select the method of moving a target die to the pick-up position.
Claims9
Die bonding apparatus comprising
- a wafer table for supporting a wafer, said wafer consisting of a plurality of dies,
- pick-up means for picking a die from a pick-up position and for transporting the die to a bonding location, and
- means for moving the wafer table comprising means for rotating the table and means for moving the table along one axis such that any selected die in said wafer is moved to said pick-up position solely by means of movement of said table along said one axis in combination with rotation of said table.
Die bonding apparatus comprising,
- a wafer table for supporting a wafer, said wafer consisting of a plurality of dies,
- pick-up means for picking a die from a pick-up position and for transporting the die to a bonding location, and
- means for moving the wafer table whereby a selected die can be moved to the pick-up position, said moving means being adapted to rotate said wafer table and to move said wafer table along two orthogonal axes, wherein said wafer table may be selectively moved in either of two alternative modes of operation to position a die at the pick-up position, wherein a first mode consists of rotation and movement solely along one of said axes, and a second mode comprises movement along said two orthogonal axes.
Dependencies are inferred from the claim text.