Carrier, method and system for handling semiconductor components

A carrier for handling and transporting a semiconductor component having a plurality of leads comprising:

• a frame comprising a pocket;
• and
• an adhesive member in the pocket capable of multiple uses comprising a polymer tape having a first adhesive surface comprising a low tack adhesive for retaining the component in the pocket, and a second adhesive surface comprising a high tack adhesive for attaching the polymer tape to the frame;
• the low tack adhesive configured to contact the leads on the component to apply a first adhesive force to the component that is selected to retain and prevent movement of the component in the pocket in X, Y and Z directions during handling and transport of the frame but to permit removal of the component from the pocket during application of a force on the component by a tool;
• the high tack adhesive configured to apply a second adhesive force to the frame selected to prevent removal of the polymer tape from the pocket during application of the force by the tool.

A carrier for handling and transporting semiconductor components comprising:

• a frame comprising a plurality of component mounting sites comprising pockets;
• and
• an adhesive member on each component mounting site comprising a length of polymer tape having a first adhesive surface comprising a repositionable adhesive capable of multiple uses and configured to retain a component on the frame, to prevent movement of the component on the frame in X, Y and Z directions during handling and transport of the frame, and to permit removal of the component from the frame by a tool, and a second adhesive surface configured to retain the adhesive member on the frame during handling and transport of the frame and during removal of the component from the frame;
• the first adhesive surface having an adhesive quality, a geometrical shape, a position on the frame and a surface area selected to exert a first adhesive force on the component;
• and
• the second adhesive surface configured to exert a second adhesive force on the frame greater than the first adhesive force.

A carrier for handling and transporting semiconductor components comprising:

• a frame comprising a plurality of component mounting sites comprising pockets;
• and
• an adhesive member on each component mounting site comprising a length of polymer tape having a first adhesive layer configured to retain a component and a second adhesive layer attached to the frame;
• the first adhesive layer comprising a repositionable adhesive capable of multiple uses and having first adhesive qualities and a first contact area with the component selected to provide a first adhesive force, the first adhesive layer sufficient to retain the component on the frame, to prevent movement of the component on the frame in X, Y and Z directions during transport and handling of the frame, and to permit removal of the component from the frame by a tool,
• the second adhesive layer comprising a pressure sensitive adhesive, a temperature sensitive adhesive or a curable adhesive having second adhesive qualities and a second contact area with the frame selected to provide a second adhesive force sufficient to retain the adhesive member on the frame during removal of the component by the tool.