Integrated circuit cooling apparatus

An apparatus for cooling an electronic device, said apparatus comprising:

• a mounting structure having a receiving aperture in alignment with said electronic device;
• a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device;
• said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface;
• a clamping arrangement attached to said mounting structure to removably secure said thermal head in operative position with respect to said mounting structure, said clamping arrangement including a clamping flange movable with respect to said thermal head but fixed with respect to said mounting structure when attached thereto, said clamping arrangement further including a clamping collar movable with respect to said clamping flange and said thermal head;
• and
• a refrigeration system in fluid communication with said flow channel of said thermal head to supply refrigerant fluid thereto.

A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:

• a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located so as to define an air pocket surrounding said electronic device;
• a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;
• at least said first housing member being formed substantially entirely of a thermally conductive material, said electronic device being thermally insulated from said first housing member by said air pocket;
• and
• a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon.

A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:

• a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located;
• a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;
• at least said first housing member being formed of a thermally conductive material;
• a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon;
• and
• said first housing member defining a first groove on said outer surface, said first heater element being located in said groove.

A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:

• a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located;
• said first housing member having a block portion defining a receiving aperture in which a thermal head of a cooling apparatus is inserted and a wall portion defining a thin wall for engagement with said circuit board, said thin wall of said first housing member being configured to define a path around electronic components mounted to said circuit board;
• a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;
• at least said first housing member being formed of a thermally conductive material;
• and
• a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon.

An apparatus comprising:

• a planar circuit board having thereon at least one electronic device to be cooled;
• a thermal housing having a removable first housing member and a removable second housing member;
• said first housing member located on a first side of said circuit board and defining an interior in which said electronic device is located;
• said first housing member further defining a receiving aperture in alignment with said electronic device;
• a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device, said thermal head being axially movable in said receiving aperture;
• and
• said second housing member being located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween.

An apparatus comprising:

• a planar circuit board having thereon at least one electronic device to be cooled;
• a thermal housing having a removable first housing member and a removable second housing member, each of said housing members being constructed of a thermally conductive material;
• said first housing member located on a first side of said circuit board and defining an interior in which said electronic device is located;
• said first housing member further defining a receiving aperture in alignment with said electronic device;
• a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device;
• said second housing member being located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;
• a respective heater element associated with each of said housing members to heat an outer surface thereof so as to prevent condensation from forming thereon;
• and
• said housing members each defining a groove on said outer surface, said respective heater element being located in said groove.

An evaporator for a cooling apparatus used for cooling an electronic device, said evaporator comprising:

• a thermal head having a cooled surface for thermal contact with said electronic device;
• said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface, said flow channel having a configuration generally characterized by a plurality of arcuate and concentric passage segments, said flow channel having scalloped sidewalls characteristic of said flow channel being formed by interconnected drill holes;
• said flow channel of said thermal head having an inlet and outlet for respective ingress and egress of said refrigerant fluid;
• an inlet tube in fluid communication with said inlet of said thermal head;
• and
• an outlet tube in fluid communication with said outlet of said thermal head.

An apparatus for cooling an electronic device, said apparatus comprising:

• a mounting structure having a receiving aperture in alignment with said electronic device;
• a thermal head axially movable in said receiving aperture such that a cooled surface of said thermal head will be guided in thermal contact with said electronic device;
• said thermal head defining a flow passage for passage of a refrigerant fluid so as to cause cooling at said cooled surface;
• and
• a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position, said clamping arrangement including a helical wave spring to urge said thermal head into engagement with said electronic device.

An apparatus for cooling an electronic device, said apparatus comprising:

• a mounting structure having a receiving aperture in alignment with said electronic device;
• a thermal head axially movable in said receiving aperture such that a cooled surface of said thermal head will be guided in thermal contact with said electronic device, said thermal head including a peripheral seal engaging an inner wall of said receiving aperture;
• said thermal head defining a flow passage for passage of a refrigerant fluid so as to cause cooling at said cooled surface;
• and
• a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position, said clamping arrangement including a spring element to urge said thermal head into engagement with said electronic device.

An apparatus for cooling an electronic device, said apparatus comprising:

• a thermal housing fixed to a circuit board on which said electronic device is mounted and having an interior in which said electronic device is located, said thermal housing serving to surround and cover said electronic device and isolate said interior thereof from an ambient environment;
• a desiccant material located in said interior of said thermal housing to absorb moisture located therein;
• a thermal head having a cooled surface in thermal contact with said electronic device;
• and
• said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface.