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US 6,543,131 B1Granted
Microelectronic joining processes with temporary securement
AssigneeTessera, Inc.
InventorsMasud Beroz, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Conductive features of the elements are connected to conductive features of the components and the temporary securements are released.
Claims13
A method of making microelectronic assemblies comprising the steps of:
- (a) temporarily securing one or more microelectronic elements in place on one or more components by providing one or more temporary securements extending between said one or more microelectronic elements and said one or more components and adhering to said one or more microelectronic elements and to said one or more components;
- then
- (b) connecting conductive features of said one or more microelectronic elements to conductive features of said one or more components;
- and
- (c) releasing said temporary securements during or after the step (b).
2 more elements
Dependencies are inferred from the claim text.