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US 6,543,130 B1Granted
Rotative cutting method and device for printed circuit boards and electric conductors
AssigneeSchober GmbH
InventorKlaus Wittmaier
Life of this patent
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Abstract
The invention relates to a method and device for producing printed circuit boards and electric conductors. The inventive device comprises a station where a conductive layer is fixed to a support material, a cutting station, connected to the first station so that the conductive layer can be cut to form a conductor and a station where cuttings are removed.
Claims6
A method for manufacturing printed-circuit boards and electric conductors comprising the steps of:
- applying a conductive layer to a substrate material;
- cutting the conductive layer by means of a rotative cutting process carried out with a rotating knife;
- pulling cuttings of an unwanted portion of the conductive layer off the substrate material;
- laminating a cover layer onto a wanted portion of the conductive layer still applied to the substrate material in a continuous process;
- producing apertures in the material sheet by means of rotating punching tools;
- and
- cutting the material sheet to the desired final shape by means of rotating knives.
4 more elements
A device for manufacturing printed-circuit boards and electric conductors comprising:
- a station in which a conductive layer is fixed to a substrate material;
- a subsequent cutting station for cutting the conductive layer into conductive traces and cuttings;
- a station for removing the cuttings;
- a laminating station for laminating a cover layer onto the substrate material that contains the conductive traces by a rotating punching tool producing apertures in the material sheet;
- and
- a rotating knife for producing the desired final shape.
3 more elements
Dependencies are inferred from the claim text.