Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector

A method of forming a solder ball on a contact, the method comprising:

• providing the contact;
• providing an apparatus having a solder-holding clip formed integrally as part thereof, the clip having a body with an opening, the body having a solder-holding conformation adjacent the opening and a solder mass positioned by the conformation, the solder-holding clip being formed of a non-wettable material;
• positioning a section of the contact proximate to the body opening;
• and
• reflowing the solder so that the solder flows into a spherical shape resulting in the solder ball being formed on the section of the contact;
• and
• removing the contact from the apparatus.

A method of forming solder balls at first ends of an array of contacts disposed in a connector according to a predetermined spaced arrangement, the method comprising:

• providing the connector;
• providing an elongated strip of material with a longitudinally extending section of the strip providing a carrier strip, the strip having an array of clips integral with the carrier strip and spaced along the carrier strip, each clip having a body portion with an opening formed therein, the body having a solder-holding conformation adjacent each opening and a solder mass held by the conformation, wherein at least the solder-holding clips are formed of a non-wettable material;
• positioning the first end of each contact proximate to a corresponding body opening;
• reflowing the solder masses so that the solder flows into a spherical shape at each clip resulting in one solder ball being formed at the first end of each contact;
• and
• separating the connector from the array of clips.

A method of forming a connector having a body with an opening for receiving a contact, the method comprising:

• providing the contact;
• providing a solder-holding clip having a body with an opening formed therein, the body having a solder-holding conformation adjacent the opening and a solder mass held by the conformation, wherein at least the solder-holding clip is formed of a non-wettable material;
• positioning a section of the contact proximate to the body opening;
• reflowing the solder so that the solder flows into a spherical shape resulting in the solder ball being formed on the section of the contact;
• separating the solder-holding clip from the contact;
• and
• inserting and retaining the contact within the opening of the connector.

A method of forming a solder ball at an end of a contact, the method comprising:

• providing the contact;
• providing a solder-holding contact carrier having a contact holding section which includes a slot for receiving the contact and a solder-holding clip section integrally formed with the contact holding section, the solder-holding clip section including a body having an opening formed therein, the opening being axially aligned with the slot of the contact carrier so that the contact may be inserted and held within the slot with an end of the contact being proximate to the opening, the clip section having a solder-holding conformation adjacent the opening and a solder mass held by the conformation, wherein at least the solder-holding clip section is formed of a non-wettable material;
• inserting the contact into the slot so that the end is proximate to the opening;
• reflowing the solder so that the solder flows into a spherical shape resulting in the solder ball being formed at the end of the contact;
• and
• removing the contact from the contact carrier.

A method of forming a solder ball at an end of a contact, the method comprising:

• providing the contact;
• providing a solder-holding clip formed of a non-wettable material, the clip including a body having an opening formed therein, the body having a solder-holding conformation adjacent the opening and a solder mass positioned by the conformation;
• positioning the end of the contact proximate to the body opening;
• reflowing the solder so that the solder flows into a spherical shape resulting in the solder ball being formed at the end of the contact;
• removing the contact from the solder-holding clip;
• and
• wherein the clip has a geometry which permits the solder mass to reflow naturally into a spherical shape above the body opening, thereby forming the solder ball, the solder ball being affixed to the contact end due to the contact end being embedded within the solder ball after the solder has cooled.

A method of forming a solder ball on a contact, the method comprising:

• providing the contact;
• providing a solder-holding structure having a surface which supports a solder mass;
• retaining the solder mass on the surface which is formed of a non-wettable material;
• positioning the contact proximate to or in partial contact with the solder mass;
• and
• reflowing the solder mass so that the solder mass flows into a spherical shape resulting in the solder ball being formed on a section of the contact.