Manufacturing system using solder self-alignment with optical component deformation fine alignment
AssigneeAxsun Technologies, Inc.
InventorsWalid A. Atia, Steven D. Conover, Eric E. Fitch, Sean P. O'Connor, Randal A. Murdza
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Abstract
A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.
Claims18
A process for assembling micro optical systems, comprising:
- depositing bond pads at locations on an optical benche determined by intended engagement points between optical components and the optical benche;
- placing optical components on the bond pads;
- performing a solder reflow process to join the optical components to the optical benche using the bond pads while allowing self alignment of the optical components that is initiated by solder surface tension;
- and
- after solidification of the solder, improving alignment of the optical components by plastically deforming the optical components on the optical benche.
A process for assembling micro optical systems, comprising:
- placing optical components on an optical benche;
- registering the optical components against registration features on the optical benche or on a template;
- joining the optical components to the optical benche;
- and
- after the optical components have been joined to the optical benche, improving alignment of optical components by plastically deforming the optical components.
Dependencies are inferred from the claim text.