Method of manufacturing a surface acoustic wave apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorShigeto Taga
Life of this patent
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Abstract
A method of manufacturing a surface acoustic wave apparatus includes the steps of bump-bonding a surface acoustic wave element and a base member together through metal bumps having a melting point of about 450° C. or higher such that the surface acoustic wave apparatus is fixed in a face down configuration to a bottom surface of a recess of the base member; and bonding a cap member and the base member with a wax material by heating the cap member and the base member uniformly at a temperature higher than a melting point of the wax material to melt the wax material.
Claims21
A method of manufacturing a surface acoustic wave apparatus, comprising the steps of:
- bump-bonding a surface acoustic wave element and a base member together through bumps having a melting point of about 450° C. or higher such that the surface acoustic wave element is fixed with a face down configuration to a bottom surface of a recess of the base member;
- and
- bonding a cap member and the base member with a wax material by heating the cap member and the base member substantially uniformly at a temperature higher than the melting point of the wax material to melt the wax material.
Dependencies are inferred from the claim text.