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AssigneeEbara Corporation
InventorsHiroshi Tomita, Soichi Nadahara, Mitsuhiko Shirakashi, Kenya Ito, Yuki Inoue
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A semiconductor substrate cleaning apparatus and method are capable of efficiently removing contamination from both the obverse and reverse sides of a semiconductor substrate. A single cleaning liquid supply nozzle for supplying a cleaning liquid to both the obverse and reverse sides of a semiconductor substrate to be cleaned is placed at a distance from the outer peripheral edge of the substrate. An ultrasonic vibrator applies ultrasonic waves to both the obverse and reverse sides of the substrate. Four driving rollers are disposed in contact with the outer peripheral edge of the substrate. The driving rollers are adapte to rotate while being engaged with the outer peripheral edge of the substrate thereby drivingly rotating the substrate.
A cleaning apparatus for cleaning a semiconductor substrate having an obverse side, a reverse side, and a peripheral edge, the cleaning apparatus comprising:
A cleaning apparatus for cleaning a semiconductor substrate having an obverse side, a reverse side, and a peripheral edge, the cleaning apparatus comprising:
A cleaning apparatus for cleaning a disc-shaped semiconductor substrate having an obverse side, a reverse side, and a peripheral edge, the cleaning apparatus comprising:
Dependencies are inferred from the claim text.