Method of dispensing a viscous material
AssigneeNordson Corporation
InventorsCarlos E. Bouras, Duong T. La, Andre S. Gamelin, Alan R. Lewis, Mark S. Meier, Alec J. Babiarz
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AssigneeNordson Corporation
InventorsCarlos E. Bouras, Duong T. La, Andre S. Gamelin, Alan R. Lewis, Mark S. Meier, Alec J. Babiarz
Estimating the term…
A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.
A method of underfilling a space between a semiconductor flip chip and a substrate to completely encapsulate a plurality of solder bumps and solder pads with a viscous material, comprising:
A method of dispensing a viscous material on an electronic component with a dispensing system including a dispensing element, the method comprising:
A method of dispensing a viscous material on an electronic component with a dispensing system including a dispensing element, the method comprising:
A method of dispensing a viscous material onto a substrate during the assembly of an electronic component and the substrate, the viscous material being heated to a first target temperature and the substrate being heated to a second target temperature, the method comprising:
A method of dispensing a viscous material onto a substrate from a dispensing element carried by an X-Y-Z positioner, the method comprising:
A method of dispensing a viscous material on an electronic component with a dispensing system including a dispensing element, a calibrating device, and a positioner, the method comprising:
Dependencies are inferred from the claim text.