Slicing of single-crystal films using ion implantation

A method for detaching a pyro-electric metal oxide single-crystal film from a pyro-electric metal oxide crystal structure, said method comprising the steps of:

• implanting non-reactive ions into said crystal structure to form a damage layer within said crystal structure at an implantation depth below a top surface of said crystal structure, said surface and said damage layer defining at least in part the single-crystal film to be detached from said crystal structure;
• bonding said surface of said crystal structure to a second substrate;
• and
• subjecting said damage layer to a rapid temperature increase to effect detachment of a single-crystal film from said crystal structure, wherein the second substrate is a semiconductor substrate having a first flat and polished insulating surface, and the bonding step comprises placing the top surface of the crystal structure in contact with the first surface of the semiconductor substrate, and subjecting the crystal structure and the semiconductor substrate to moderate heating while using a relatively light force to hold the crystal structure against the semiconductor substrate for a sufficiently long time to effect electrostatic bonding of the crystal structure to the semiconductor substrate.