Diamond coatings on reactor wall and method of manufacturing thereof
AssigneeLam Research Corporation
InventorsRobert J. O'Donnell, John E. Daugherty, Christopher C. Chang
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Abstract
A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a diamond containing surface and process for manufacture thereof.
Claims31
A component of semiconductor processing equipment comprising a diamond containing material exposed to plasma in the equipment, the diamond containing material comprising diamond or a diamond-like material and from about 20 to about 80 wt. % of at least one additional material.
A component of semiconductor processing equipment comprising a diamond containing material exposed to plasma in the equipment, the diamond containing material having a thickness of at least 0.004 inches.
A process of coating a surface of a component of semiconductor processing equipment, the processing comprising:
- (a) optionally depositing a first intermediate coating on a surface of a component of semiconductor processing equipment;
- (b) optionally depositing a second intermediate coating on said first intermediate layer or on said surface;
- and
- (c) depositing a diamond containing material on said component to form an outer corrosion resistant surface, the diamond containing material having a thickness of at least 0.004 inches and being exposed to plasma in the equipment.
Dependencies are inferred from the claim text.