US 6,537,411 B1 · Method for low temperature lamination of metals to polyimides

Abstract

The present invention is directed to a method for the lamination of metals, and especially copper, to the surface of polyimides and derivatives of polyimides at temperatures substantially below the curing temperature of the imide polymers. More specifically, the invention is directed to a method for surface modification of polyimides and derivatives of polyimides by thermal graft copolymerization and interfacial polymerization with concurrent lamination of the metal of interest in the presence of an appropriate functional monomer. The process can be carried out under atmospheric conditions and either in the presence or the complete absence of an added polymerization initiator. The so laminated polyimide-metal interfaces exhibit T-peel adhesion strengths in excess of 16 N/cm. The adhesion strength also exceeds the fracture strength of polyimide films with a thickness of 75 μm.

Claims14

Dependent claims

A method for laminating a metal to a polyimide or to a polyimide derivative comprising:

i) subjecting the polyimide or polyimide derivative to thermal graft copolymerization and to interfacial polymerization in the presence of the metal;
ii) laminating the metal and the polyimide or polyimide derivative in the presence of a functional monomer;
wherein steps i) and ii) are performed simultaneously and at a temperature below the glass transition temperature, melting point or curing temperature of the polyimide or polyimide derivative.

Dependencies are inferred from the claim text.

Facts

Application

09/604,960Filed 28 Jun 2000

Priority

SG 990321829 Jun 1999

Granted

25 Mar 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

C08J 7/16
Chemical modification: with polymerisable compounds
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
C08J 5/124
Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives: using…
H05K 3/38
Apparatus or processes for manufacturing printed circuits: improvement of the adhesion between the insulating substrate and the metal

Method for low temperature lamination of metals to polyimides

Life of this patent

Method for low temperature lamination of metals to polyimides

Life of this patent

Abstract

Claims14