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AssigneeMurata Manufacturing Co., Ltd.
InventorsMasanobu Okada, Tomoyuki Koide, Kazuyoshi Nakaya, Hiroyuki Nakaji
Estimating the term…
End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other.
A module substrate comprising a substrate for mounting an electronic component on the front surface side thereof, and end-face electrodes provided in end-faces defining an outer peripheral edge of the substrate and adapted to be connected to the electronic component, said end-face electrodes each being provided with a solder to be connected to a mother board provided on the back surface side of the substrate, said solder being protruded on the back surface side of the substrate past a thickness of a portion of the end-face electrode extending onto the back surface side of the substrate and comprising a columnar shape without a laterally projecting portion on the portion of the end-face electrodes disposed on the back surface side of the substrate.
A method of producing a module substrate comprising a substrate for mounting an electronic component on the front surface side thereof, and end-face electrodes provided in the end-faces defining the outer peripheral edge of the substrate and adapted to be connected to the electronic component, said end-face electrodes each being provided with a solder to be connected to a mother board, the method comprising the steps of:
Dependencies are inferred from the claim text.