Ball grid array connector having improved contact configuration
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsGenn-Sheng Lee, Ming-Lun Szu
Life of this patent
Estimating the term…
Abstract
An electrical socket for electrically connecting with a pin of a IC package. A contact secured in the socket comprises first and second claw portions formed on opposite ends thereof and two spring arms between the first and second claw portions for being engaged with the IC package pin. The first and second claw portions have two claw feet, respectively. The four claw feet define a clip section in which a solder ball can be received and kept in a predetermined plane when the solder ball is pressed towards the contact. The claw feet can grip the solder ball firmly to avoid the falling of the solder ball during assembling and soldering procedure.
Claims6
A contact received in an electrical socket for interconnecting an integrated circuit (IC) package with a printed circuit board (PCB), comprising:
- a contact portion for engaging with a pin of the IC package;
- a first ball retention portion formed on one end of the contact portion and having a first ball clip means for engaging with a solder ball;
- and
- a second ball retention portion formed on another end of the contact portion and having a second ball clip means for engaging with the solder ball, at least one clip means extending substantially towards the other clip means, and a clip section defined between the first clip means and second clip means;
- when the solder ball is engaged with the first and second clip means, the distance of the clip section changed in accordance with the size of the solder ball, whereby the solder ball is securely kept in the clip section by the first and the second clip means,
- wherein the at least one clip means, formed as a claw foot, is substantially perpendicular to contact surface of the solder ball.
A contact received in an electrical socket for interconnecting an integrated circuit (IC) package with a printed circuit board (PCB), comprising:
- a contact portion for engaging with a pin of the IC package;
- a first ball retention portion formed on one end of the contact portion and having a first ball clip means for engaging with a solder ball;
- and
- a second ball retention portion formed on another end of the contact portion and having a second ball clip means for engaging with the solder ball, at least one clip means extending substantially towards the other clip means, and a clip section defined between the first clip means and second clip means;
- when the solder ball is engaged with the first and second clip means, one of the clip means yields outwardly and a wiping action is generated between the first and the second clip means and a curved surface of the solder ball along a direction substantially tangential to the curved surface of the solder ball, the wiping action being stopped when the solder ball is located at a predetermined position;
- wherein the at least one clip means, formed as a claw foot, is substantially perpendicular to contact surface of the solder ball.
Dependencies are inferred from the claim text.