Semiconductor wafer cleaning apparatus
AssigneeLG Semicon Co., Ltd.
InventorsYun Jun Huh, Suk Bin Han, Jae Jeong Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.
Claims5
A semiconductor wafer cleaning apparatus comprising:
- an outer tank;
- a cleaning tank provided within said outer tank;
- a wafer carrier provided within said cleaning tank;
- a plurality of jet nozzles directed toward said wafer carrier, each of said plurality of jet nozzles including a plurality ofjet nozzle holes formed lengthwise therethrough, wherein a first of the plurality of jet nozzles is located at a bottom center of the cleaning tank with the plurality of jet nozzle holes facing upward and a second of the plurality of jet nozzles is located at both sides of the cleaning tank with the plurality ofjet nozzle holes facing a center of the wafer carrier at an oblique angle;
- a main pipe connected to said jet nozzles;
- a circulating pump connected to said main pipe and said outer tank for circulating a cleansing solution from said outer tank, through said main pipe, said jet nozzles, and said cleaning tank, and back to said outer tank, the cleansing solution being directly sprayed from said jet nozzles onto left, right, and bottom sides of the wafer;
- and
- a filter for filtering said circulated cleansing solution.
A semiconductor wafer cleaning apparatus comprising:
- a cleaning environment having a wafer carrier;
- and
- a plurality of jetting means for jetting a liquid against a wafer within said cleaning environment, each said jetting means including a plurality of jet nozzle holes, wherein a first of the plurality ofjetting means is located at a bottom center of the cleaning tank with the plurality of jet nozzle holes facing upward and a second of the plurality of jetting means is located at both sides of the cleaning tank with the plurality of jet nozzle holes facing a center of the wafer carrier at an oblique angle, wherein said liquid is directly sprayed from said jetting means onto left, right, and bottom sides of the wafer.
Dependencies are inferred from the claim text.