US 6,531,328 B1Granted

Packaging of light-emitting diode

AssigneeSolidlite Corporation

InventorHsing Chen

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Abstract

The present invention of “Packaging of Light-Emitting Diode” is mainly to use silicon wafer as the substrate, whose crystal surface has a specific orientation for etching to form grooves. On the back of silicon substrate, dry etching is used for through-hole electrodes. Meanwhile, the insulating oxide layer or the nitride layer on silicon surface is plated with a reflective layer and an electrode layer, so the LED substrate is actually made of “silicon substrate”. Through the procedures including placement of LED chips in the grooves of a silicon substrate, die bonding, wire bonding, encapsulation and cutting, SMD LED can be formed. Compared to traditional LED packaging that uses circuit boards or metal leadframes as main packaging substrates, the present invention is a breakthrough, which uses silicon wafers as substrates, so it has several advantages including good heat dissipation, high heat resistance and easy miniaturization, which are not seen in common LED presently.

Claims7

Dependent claims

A process for forming an LED packaging substrate, comprising the steps of:

a. providing a silicon wafer substrate having opposing front and back sides;
b. applying photoresist on the front side of the silicon wafer substrate;
c. exposing and developing the photoresist to define predetermined areas;
d. wet etching the substrate to form groove reflectors;
e. applying photoresist on the back side of the silicon wafer substrate;
f. exposing and developing the photoresist to define a through-hole pattern in respective aligned relationship with the groove reflectors;
g. dry etching the through-hole pattern to form electrode holes through the silicon wafer substrate;
h. removing the photoresist from the silicon wafer substrate;
i. forming an insulation layer on the front and back sides of the substrate by oxidation or nitridation;
j. applying a conductive metal layer by electroplating to the front and back sides of silicon substrate and inside electrode holes;
and,
k. laser treating the conductive metal layer to cut an electrode surface in the groove reflectors into positive and negative electrode contacting surfaces for respective connection with LED chips placed inside the groove reflectors.

9 more elements

Dependencies are inferred from the claim text.